导语：
3月25日联合技术论坛在上海浦东成功落下帷幕。本次强强联手的行业盛会吸引了逾40位光罩制造行业资深专家参与，共同探索光罩工艺升级与半导体产业链协同创新的技术路径。
Introduction:
On March 25th, HMG together with technology giants in the photomask industry: ZEISS, SUSS, and Mycronic - held a joint technology forum, which successfully concluded in Pudong, Shanghai. This strong alliance industry event attracted over 40 senior experts in the photomask manufacturing industry to participate, jointly exploring the technological path of photomask process upgrading and collaborative innovation in the semiconductor industry.
PART01论坛启幕Forum opening
此次论坛议程精彩纷呈，聚焦技术研讨与深度交流。四家公司代表致以热烈的欢迎词后，主题演讲环节正式开启。
下午，客户管理高级经理陈盈瀛以 “赋能中国半导体产业：先进技术的作用”为主题，深入阐释了如何凭借技术创新与数字化管理双轮驱动，为半导体客户量身定制的供应链服务方案。
The agenda of this forum is action-packed, focusing on technical discussions and in-depth exchanges. After representatives from four companies delivered warm welcome speeches, the speech session officially began.
In the afternoon, Chen Yingying, Senior Manager of Customer Management at HMG, gave a speech on the theme of "Empowering China's Semiconductor Industry: The Role of Advanced
Supply Chain Services". She elaborated on how HMG, driven by technological innovation and digital management, provides tailored supply chain service solutions for semiconductor customers.
PART02 聚焦HMG：技术创新与数字化管理
Focusing on HMG: Technological Innovation and Digital Management
通过大量技术创新投入，推动业务与制度双重创新，为客户提供端到端、唯一码的全流程供应链可视化和数字化管理服务，提高了供应链透明度与效率，降低了客户管理难度，节省时间和资源，助力客户专注于核心业务。
HMG has invested heavily in technological innovation to promote dual innovation in business and system, providing customers with end-to-end, unique code whole-process supply chain visualization and digital management services, improving supply chain transparency and efficiency, reducing customer management difficulties, saving time and resources, and helping customers focus on core business.
我司展示的完整产业链画像和动态图谱，通过创新服务平台架构，提升了产业链质量和效率。其搭建的集成电路产业供应链共享协同专业服务平台，利用各类模块化供应链服务引擎，为材料、设计、采购、制造、维修等环节提供全方位服务。平台采用微服务框架组件库、大数据系统和通用PaaS平台等技术，支持关键操作，通过云基础设施和边缘层设备接入，实现供应链实时监控与响应。
The comprehensive supply chain mapping displayed by HMG have improved the quality and efficiency of the industrial chain through innovative service platform architecture. The integrated circuit industry supply chain sharing and collaborative professional service platform it has built utilizes various modular supply chain service engines to provide comprehensive services for materials, design, procurement, manufacturing, and maintenance. The platform adopts technologies such as microservice framework, big data system, and general-purpose PaaS platform to support critical operations. Through cloud infrastructure and edge layer device access, it achieves real-time monitoring and response of the supply chain.
在演讲中，还介绍了供应链管理中的具体应用与案例，如超自动化平台的梯形结构、IDP 流程的智能文档处理技术、RPA机器人在政策法规数据库中的应用、货运全流程监控解决方案以及数字孪生仓库项目等。这些创新技术和应用充分展示了在供应链服务领域的强大实力与领先地位，赢得了现场嘉宾的高度赞誉与认可。
In the speech, HMG also introduced specific applications and cases in supply chain management, such as the trapezoidal structure of the hyper-automation platform, the intelligent document processing technology of the IDP process, the application of RPA robots in policy and regulation databases, the whole-process monitoring solution for freight transportation, and the digital twin warehouse project. These innovative technologies and applications fully demonstrate HMG's strong strength and leading position in the field of supply chain services, winning high praise and recognition from the on-site guests.
PART03展望未来Look into the future
本次论坛除主题演讲外，特设专家圆桌讨论环节，参会嘉宾与四家企业技术专家围绕半导体行业热点深入探讨，现场互动踊跃，专家解答为与会者提供了前沿洞见与实操指导。
In addition to the speech session, this forum also features panel discussion. Attendees and technical experts from four companies conducted in-depth discussions on hot topics in the semiconductor industry, with active on-site interaction. Expert answers provided cutting-edge insights and practical guidance for attendees.
闭幕式上，主办方总结指出，论坛通过搭建高效技术交流平台，促进了产业链上下游资源整合与协同创新。活动不仅彰显了泓明在高端供应链服务领域的创新实力，更通过专业内容输出强化了行业生态合作。
At the closing ceremony, the organizer summarized that the forum has promoted the integration and collaborative innovation of upstream and downstream resources in the industrial chain by building an efficient technology exchange platform. The event not only showcased HMG's innovative strength in the field of high-end supply chain services, but also strengthened industry ecological cooperation through professional content output.
未来，将持续以技术创新为驱动，优化供应链服务体系，助力中国半导体产业提升国际竞争力，赋能行业高质量发展。
In the future,HMG will continue to drive technological innovation, optimize the supply chain service system, help China's semiconductor industry enhance its international competitiveness, and empower the industry to develop with high quality.
